中文網
Taipei
Sat, Jun 3, 2023
13:31
CONNECT WITH US

Qualcomm, MediaTek mull fan-out packaging for flagship handset APs

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia 0

Qualcomm and MediaTek are both considering adopting fan-out PoP in the production of their flagship smartphone application processors, following in the footsteps of Apple utilizing TSMC's InFO_PoP technology to package its iPhone chips, according to...

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.
Global wafer foundry industry analysis and forecast, 2022
Global server shipment forecast and industry analysis, 2022