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Ansys multiphysics solutions certified by TSMC

Jessie Shen, DIGITIMES, Taipei Thursday 27 August 2020 0

Ansys has achieved certification of its advanced semiconductor design solution for TSMC's CoWoS with silicon interposer (CoWoS-S) and InFO with RDL interconnect (InFO-R) advanced packaging technologies, according to the EDA firm.

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