Bits + chips
TSMC packaging development to remain focused on SoIC, organic interposer in 2021
Julian Ho, Taipei; Willis Ke, DIGITIMES

TSMC is expected to continue its advanced packaging development focus on 3D SoIC (system on integrated chips) technology and organic interposer in 2021, although it has fabricated WSE (wafer-scale engine) AI chips for Cerebras with InFo-SoW packaging...

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