Global wafer foundry industry analysis and forecast, 2022

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Home Tech Semiconductors

ASE poised to apply SESUB-based SiP tech to new TWS devices

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Monday 25 May 2020 0

Taiwan's backend leader ASE Technology is poised to apply its SESUB (semiconductor embedded in substrate)-based SiP packaging technology to next-generation TWS (true wireless stereo) earphones to be rolled out by Apple, after being contracted to handle...

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