Huawei/HiSilicon to commercialize new NB-IoT chip solution in 4Q20
Staff reporter, Shanghai; Willis Ke, DIGITIMES
Huawei/HiSilicon will commercialize a new NB-IoT chipset, dubbed Boudica 200, by the end of 2020, which will support 3GPP R15 standards and offer lower latencies and more integrated features in a smaller form factor, according to company sources.
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