CONNECT WITH US
Out in Front
Sponsored

Intel to intro innovative thermal design for notebooks

Aaron Lee, Taipei; Joseph Tsai, DIGITIMES Asia 0

At the upcoming CES 2020, Intel is planning to announce a new thermal module design that is able to enhance notebooks' heat dissipation by 25-30% with many brands also set to showcase products using the innovation during the show, according to sources...

The article requires paid subscription. Subscribe Now