Bits + chips
Highlights of the day: FPCB makers eyeing 5G iPhone orders
DIGITIMES staff

Apple is expected to launch 5G iPhones in 2020, and the next-generation phones may change its antenna board designs to facilitate mmWave transmission. Taiwan-based flexible PCB makers including Zhen Ding Technology and Flexium Interconnect are gearing up to capture orders for flexible antenna boards for 5G iPhones. The arrival of the 5G era is set to rejuventate the smartphoen market and at the same time spur 5G network construciton. Fast expansion of 5G infrastructure is expected to benefit Macronix, a major supplier of NOR flash for use in 5G base stations.

Flexible PCB makers gearing up for 5G iPhone antenna orders: Taiwan-based flexible PCB makers including Zhen Ding Technology and Flexium Interconnect are gearing up to capture orders for flexible antenna boards for 5G iPhones, especially those for LCP (liquid crystal polymer) boards likely to be used in Apple's new-generation offerings, according to industry sources.

Macronix gearing up for 3D NAND flash: Macronix International is poised to kick off commercial shipments of 48-layer 3D NAND flash chips in the second half of 2020, followed by volume shipments of 96-layer 3D NAND products in 2021, according to company chairman Miin Wu.

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