LTCC to be mainstream packaging material for mmWave modules
Jay Liu, Taipei; Willis Ke, DIGITIMES
The market for packaging materials for 5G mmWave transmission modules is set to heat up in 2020, with LTCC (low temperature co-fired ceramic) likely to replace LCP (liquid crystal polymer) as the mainstream material, according to industry sources.
The article you are trying to open requires News database subscription. Please sign in if you wish to continue.