Forcecon introduces new cooling solutions for notebooks, smartphones

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Forcecon introduces new cooling solutions for notebooks, smartphones

Aaron Lee, Taipei; Steve Shen, DIGITIMES

Monday 18 November 2019

Taiwan-based heat dissipation solution provider Forcecon Technology has introduced a new form of heat pipe, thermal ground plane (TGP), thickened 0.2mm for notebook and smartphone applications, according to company chairman Yao Cheng-chi.

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