While top chip vendors have been keen on securing support from TSMC's cutting edge 7nm and 5nm manufacturing nodes, demand for the foundry house's other processes have also been strong. Now TSMC and its fellow competitor UMC are both set to allocate more of their 12-inch fab capacity to making driver ICs to meet growing demand for 8K and 5G applications. Meanwhile, TSMC has obtained approval from environmental authorities for building an advanced packaging fab project in northern Taiwan - a project aimed at strengthen its 3D heterogeneous integration packaging capabilities. China-based SMIC, in line with the country's bid for semiconductor self-sufficiency, has been trying to catch up with the global leader in the pure-play foundry sector. Its latest development has seen it moving closer to volume production for 12nm FinFET.
TSMC, UMC to allocate more 12-inch fab capacity for display driver IC: TSMC and UMC are set to allocate more of their available 12-inch fab capacities for the fabrication of display driver ICs in 2020 to satisfy growing demand for applications such as 8K TVs and 5G smartphones, according to industry sources.
TSMC to build advanced packaging fab in northern Taiwan in 2020: TSMC's planned advanced packaging plant in Miaoli, Northern Taiwan has passed environmental impact assessment, enabling the foundry house to kick off construction of the new fab in 2020 as scheduled, which is expected to benefit the semiconductor equipment supply chain, according to industry sources.
SMIC to move 12nm FinFET process to risk production by year-end 2019: China's Semiconductor Manufacturing International (SMIC) has kicked off volume production of 14nm FinFET chips, and plans to move a newer 12nm FinFET process to risk production by the end of 2019, according to sources familiar with the matter.