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Home Tech Chips + Components

TSMC to accelerate 3nm fab construction

Monica Chen and Rebecca Kuo, Tainan; Jessie Shen, DIGITIMES Asia Thursday 24 October 2019 0

TSMC is expected to step up the construction of its advanced 3nm wafer fab after securing 30 hectares of land in the Southern Taiwan Science Park (STSP) by the end of 2019, according to industry sources.

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Categories

Chips + components IC manufacturing

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12-inch 2020 capacity fab GET Qualcomm science park Southern Taiwan Science Park STSP Taiwan TSMC wafer wafer fab

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