Backend house ASE Technology Holding has offered a development board based on its system-in-package (SiP) services for heterogeneous SoC chips designed for true wireless stereo (TWS) devices, according to market sources.
Such heterogeneous solution comprising of TWS components integrated with MEMS sensors is designed for healthcare, sports and fitness applications, said the sources. The chip demands SiP to support its heterogeneous integration of all these diverse chips, the sources continued.
With its SiP offering for heterogeneous chips, ASE Technology is eyeing orders from not only fabless chipmakers but also white-box device makers, the sources indicated.
In response, ASE Technology said it does not comment on specific customers and orders.
ASE Technology has seen its SiP business expand substantially so far this year amid growing demand for heterogeneous chips integration to support increasingly complicated 5G, AI and IoT applications, company CFO Joseph Tung was quoted as saying in previous reports. ASE has set a goal for its SiP business revenues to grow by US$100 million per year, and the goal for 2019 has already been achieved ahead of schedule, according to Tung.
Amkor Technology, another OSAT company eyeing huge SiP business opportunities arising from TWS devices and other emerging IoT applications, has reportedly obtained orders for Apple's AirPods.
Article translated by Jessie Shen
