中文網
Taipei
Thu, Sep 29, 2022
21:55
CONNECT WITH US

COF packaging demand for OLED DDI chips to grow sharply in 2020

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia 0

COF substrate makers and related packaging houses are expected to operate at full capacity through the end of 2019 on robust demand from smartphone vendors, and their revenues may be further driven by explosive demand for OLED DDI (display driver IC)...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories
8 ways to streamline your global supply chain for electronics products
DIGITIMES Research Special Report Databases