Order visibility for IC packaging materials clear throughout 3Q19

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Order visibility for IC packaging materials clear throughout 3Q19

Julian Ho, Taipei; Willis Ke, DIGITIMES

Wednesday 10 July 2019

Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced semiconductor assembly and test) firms in the peak season, according...

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