Chipbond to suspend 5G PA packaging capacity expansion

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Chipbond to suspend 5G PA packaging capacity expansion

Julian Ho, Taipei; Willis Ke, DIGITIMES

Monday 17 June 2019

Chipbond Technology will put on hold its 5G PA (power amplifier) packaging capacity expansion originally set to be enforced in the second half of 2019, due mainly to the uncertainties associated with the US trade ban on China's Huawei, according to...

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