HiSilicon keen to develop modem-integrated 5G mobile SoCs

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia 0

Huawei's chipmaking arm HiSilicon is aggressively planning the development of its 5G mobile SoC integrating a modem chip, as well as 5G mmWave solutions for smartphones after releasing its Kirin 985 series mobile AP in the second half of 2019, according...

The article requires paid subscription. Subscribe Now