Bits + chips
DNP, Winbond team up for eSIM
Siu Han, Taipei; Jessie Shen, DIGITIMES

Dai Nippon Printing (DNP) has announced it is teaming up with Winbond Electronics to develop eSIM and other secure elements for IoT devices.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.