IT + CE
Cloud services to disrupt IC design process: Q&A with Microsoft Taiwan GM Ken Sun
Aaron Lee, Taipei; Willis Ke, DIGITIMES

At the Open Innovation Platform (OIP) Ecosystem Forum held in early October, Taiwan Semiconductor Manufacturing Company (TSMC) announced the launch of OIP Virtual Design Environment (OIP VDE) and the formation of OIP Cloud Alliance in cooperation with...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.