Bits + chips
Chipbond enters Huawei smartphone supply chain
Julian Ho, Taipei; Jessie Shen, DIGITIMES

Chipbond Technology has entered the supply chain for Huawei's smartphones by providing chip-on-film (COF) packaging for OLED panel driver ICs, according to industry sources.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.