UMC to more than double 80nm process capacity for TDDI chips

Cage Chao, Taipei; Jessie Shen, DIGITIMES Asia 0

Pure-play foundry United Microelectronics (UMC) plans to expand its 80nm process capacity by over 100% in the fourth quarter of 2018 to satisfy the growing demand for TDDI (touch with display driver integration) chips for use in smartphones featuring...

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