Bits + chips
Shunsin reportedly earns new 3D sensing module orders
Julian Ho, Taipei; Jessie Shen, DIGITIMES

Shunsin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, has obtained new orders for 3D sensing modules for use in high-end fiber-optic devices and consumer...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.