United Microelectronics Corporation (UMC), a leading global semiconductor foundry, recently held its 2018 China Technology Forum at Jumeirah Himalayas Hotel Shanghai in Shanghai, China. UMC detailed its foundry solutions that drive the company's "IC 2.0," or Intelligently Connected theme, including its specialized technologies, IP, and strong China manufacturing presence to serve China customers designing chips for AI, 5G, IoT and automotive applications.
UMC's co-president SC Chien delivered the keynote address to over 200 customers and supply chain partners from China's semiconductor industry.
Chien said, "The Intelligently Connected era, which we call IC 2.0, will open up a new realm of possibilities with regard to new chips in 5G, AI, IoT, and automotive being introduced into our everyday lives. UMC will help Chinese design houses take early advantage of these high growth opportunities, as we have leveraged our decades of world-class semiconductor manufacturing experience with custom engineered foundry solutions specifically directed at Intelligent Connectivity to become the best foundry choice for chip designers."
UMC's China manufacturing base consists of HeJian, a high capacity 8-inch fab in Suzhou, and Fax 12X, an advanced 12-inch fab located in Xiamen that is in high yield volume production for technologies including 40nm and 28nm High-K/Metal-Gate. The company also operates United Design Service in Shandong, which offers turnkey design service to China customers.
UMC can be found on the web at http://www.umc.com.
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