Most Android smartphone vendors, particularly those in China, are still reluctant to adopt 3D sensing technology for their new models to be launched in 2018 due to the persistent high prices of 3D sensing modules, according to sources from Taiwan-based IC-design houses.
Some IC vendors had originally hoped that demand for 3D sensing modules would pick up significantly in the first quarter of 2018 amid speculations that Apple would continue to use 3D sensing for new iPhones to be released later in the year and expand the adoption of such technology to include large-size iPad devices.
However, the supply of some key components for the production of 3D sensing modules has been tight due to insufficient production capacity, keeping 3D sensing module prices at high levels, said the sources.
Prices of 3D sensing modules are currently hovering between US$30 and US$50 a unit, the sources indicated.
Apple's plan to expand the adoption of 3D sensing products is likely to aggravate the supply constraints within the industry, further undermining other smartphone vendors' efforts to adopt 3D sensing technology, commented the sources, noting that Samsung Electronics appears to have decided to not incorporate 3D sensing applications for its mobile devices in the short term.
Qualcomm, MediaTek and Unigroup Spreadtrum & RDA have shifted their focus to develop their platform solutions enabled for more AI-centric applications, instead of promoting 3D sensing applications, said the sources.
Article translated by Steve Shen
