Bits + chips
Micron announces mobile 3D NAND solutions for flagship smartphones
Jessie Shen, DIGITIMES, Taipei

Micron Technology has announced three new 64-layer, second-generation 3D NAND storage products, which support the high-speed Universal Flash Storage (UFS) 2.1 standard. Micron's new mobile 3D NAND products are available in 256GB, 128GB and 64GB capac...

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