中文網
Taipei
Mon, Jun 27, 2022
03:52
mostly cloudy
26°C
CONNECT WITH US

Toshiba develops 3D flash memory with TSV technology

Jessie Shen, DIGITIMES, Taipei 0

Toshiba has announced development of its BiCS flash three-dimensional (3D) flash memory utilizing through-silicon via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology. Shipments of prototypes for development purposes started...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories