Bits + chips
Toshiba to begin mass production of 64-layer, 512-gigabit 3D flash in 2H17
Michael McManus, DIGITIMES, Taipei

Toshiba has unveiled the latest addition to its line-up of BiCS flash 3D flash memory with a stacked cell structure, a 64-layer device that achieves a 512-gigabit (64-gigabytes) capacity with 3-bit-per-cell (triple-level cell, TLC) technology.

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