We have recently changed our search engine. Check the Advanced options to learn the new search rules.
Bits + chips
TSMC collaborates with Mentor Graphics enabling design and verification tools for new InFO technology variants
Press release; Jessie Shen, DIGITIMES
TSMC has extended its collaboration with Mentor Graphics on the Xpedition Enterprise platform in conjunction with the Calibre platform for the design and verification of TSMC's integrated fan-out (InFo) packaging technology for multi-chip and chip-DRAM...
The article you are trying to open requires News database subscription. Please sign in if you wish to continue.