ASE to raise funds through issuing new shares, bonds

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ASE to raise funds through issuing new shares, bonds

MOPS; Jessie Shen, DIGITIMES

Friday 9 December 2016

Taiwan-based Advanced Semiconductor Engineering (ASE) has disclosed plans to issue new shares and unsecured corporate bonds. Proceeds from the share and bond issues will be used to repay bank loans, according to the packaging and testing company.

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