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Home Tech Chips + Components

Taiwan firms enter supply chain for 2017 iPhone

Julian Ho, Taipei; Jessie Shen, DIGITIMES Tuesday 16 August 2016 0

In addition to Taiwan Semiconductor Manufacturing Company (TSMC), Chipbond Technology and MJC Probe (MPI) have entered the supply chain for Apple's 2017 iPhone series, according to industry sources.

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Categories

Chips + components Display components Displays + photonics IC design, distribution IC manufacturing Mobile + telecom Mobile components

Tags

2017 Apple Chipbond iPhone MJC Probe MPI supplier Taiwan TSMC

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Chipbond Technology MPI Corporation Taiwan Semiconductor Manufacturing Company

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