Bits + chips
Cadence launches complete IC packaging design and analysis solutions for fan-out WLCSP
Press release; Jessie Shen, DIGITIMES

Cadence Design Systems has announced the availability of foundry-proven IC packaging design and analysis solutions for advanced fan-out wafer-level chip scale packaging (WLCSP) and 2.5D interposer-based designs. The new capabilities enable the faster...

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