中文網
Taipei
Wed, Jul 6, 2022
21:25
partly cloudy
28°C
CONNECT WITH US

TSMC to triple 16nm chip capacity by end-2016, says co-CEO

Josephine Lien, Taipei; Jessie Shen, DIGITIMES 0

TSMC is set to move its 16nm FinFET Plus (16FF+) process to commercial production in the second half of 2015, and plans to introduce a compact version of the 16FF+ process in early 2016, according to president and co-CEO CC Wei. Total production capacity...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories