Bits + chips
Intel, Micron unveil new 3D NAND flash memory
Press release; Jessie Shen, DIGITIMES

Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies, stacks layers of data storage cells vertically to create storage devices with three times higher capacity...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.