中文網
Taipei
Sun, Dec 4, 2022
22:53
light rain
21°C
CONNECT WITH US

ASE, Inotera reportedly to set up 3D IC packaging joint venture

Josephine Lien, Taipei; Steve Shen, DIGITIMES Asia 0

Advanced Semiconductor Engineering (ASE) reportedly plans to team up with Inotera Memories to set up a joint venture for handling TSV (through-silicon via) 3D IC packaging.

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories