Bits + chips
STATS ChipPAC fcCuBE technology achieves significant growth in 2013
Press release; Jessie Shen, DIGITIMES

STATS ChipPAC has announced that unit shipments of semiconductor packages utilising its patented fcCuBE technology more than quadrupled in 2013 compared to 2012. The performance and cost advantages of this advanced flip-chip packaging technology has...

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