Bits + chips
TSMC adjusting capacity to meet rising orders for bumping services
Mavis Hong, Taipei; Jessie Shen, DIGITIMES

TSMC expects its in-house capacity for wafer bumping services will fail to satisfy customer demand, and plans to outsource more orders for 8-inch wafers for use in the manufacture of power management ICs and graphics chips, according to industry sour...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.