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TSMC adjusting capacity to meet rising orders for bumping services

Mavis Hong, Taipei; Jessie Shen, DIGITIMES Asia Monday 16 December 2013 0

TSMC expects its in-house capacity for wafer bumping services will fail to satisfy customer demand, and plans to outsource more orders for 8-inch wafers for use in the manufacture of power management ICs and graphics chips, according to industry sour...

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