TSMC adjusting capacity to meet rising orders for bumping services

Taipei, Tuesday, July 7, 2020 14:07 (GMT+8),

35°C

中文繁體 | 簡體

We have recently changed our search engine. Check the Advanced options to learn the new search rules.

Fusion Worldwide: Sourcing you need, service you deserve

Disconnected ICT Supply Chains: New Power Plays Unfolding

Bits + chips

TSMC adjusting capacity to meet rising orders for bumping services

Mavis Hong, Taipei; Jessie Shen, DIGITIMES

Monday 16 December 2013

TSMC expects its in-house capacity for wafer bumping services will fail to satisfy customer demand, and plans to outsource more orders for 8-inch wafers for use in the manufacture of power management ICs and graphics chips, according to industry sour...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.

Sponsored links

Mini/micro LED: Challenges and opportunities in the display industry
Mini LEDs and micro LEDs are expected to become improved backlighting solutions that can significantly enhance displays quality and create added value in the upcoming years.
Global server shipment forecast and industry analysis, 2020
Digitimes Research estimates that global server shipments moderately declined 1.4% in 2019 but will turn to show positive growth of 6.6% in 2020, totaling 16.01 million units.
Global AP demand forecast, 2017-2022
Worldwide shipments of smartphone application processors are expected to fall.

Digitimes Research Quarterly Data services

© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.

Members only