Globalfoundries' combined capacity for 28/32nm chips has climbed to 60,000-80,000 wafers a month, according to Michael Noonen, the foundry's executive VP for marketing and sales.
Globalfoundries currently fabricates 28nm products at its fabs in the US (Fab 8) and Germany (Fab 1), said Noonen, adding that the process is expected to be the mainstream IC process technology in 2013. In 2013, the foundry is also looking to start building chips using 20nm process technology, Noonen indicated.
In addition, Globalfoundries' recently-introduced 14nm process with 3D FinFET transistors will be ready for trial production in 2014, Noonen noted.
Production utilizing the newer 20nm and 14nm process technologies will take place at Globalfoundries' Fab 8 in New York, Noonen disclosed.
Globalfoundries' Fab 1 in Dresden, Germany is capable of producing 80,000 12-inch wafers monthly while Fab 8 processes 60,000 units. The former plant focuses on the production of chips using 45nm and smaller process nodes, and the latter 28nm and more advanced technologies. Globalfoundries also has a 12-inch fab located in Singapore - Fab 7 - targeting the fabrication of 40nm and above processes with monthly capacity of 50,000 wafers.
Globalfoundries gearing up for 20nm in 2013 and 14nm in 2014
Photo: Michael Lee, Digitimes, October 2012
Article translated by Jessie Shen
