ASE, SPIL make progress in transition to copper wire bonding

Mavis Hong, Taipei; Jessie Shen, DIGITIMES Asia Tuesday 31 July 2012 0

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have made progress toward the transition from gold to copper wire bonding, and have also stepped up the development of advanced packaging solutions to meet growing...

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