Driver IC packaging testing service provider Chipbond Technology has obtained orders for COG (chip on glass) chips used in screens for a new version of the iPhone, and 8-inch gold bumping for large-sized TFT-LCD panels produced by Samsung Electronics, according to industry sources.
With a monthly packaging and testing capacity of over 100 million COG chips, Chipbond began shipments of 15 million to Apple a month in May, the sources indicated. As a result, Chipbond will see utilization of its COG and 12-inch gold bumping capacity in the second quarter of 2012 higher than its originally expected 75%, the sources noted.
Chipbond will start shipments of packaged driver ICs to Samsung in the second half of 2012, the sources said.
In addition, Chipbond is expected to receive orders for driver ICs for WVGA panels for cheap smartphones from Taiwan-based IC design houses at the end of June, the sources indicated.
Article translated by Adam Hwang
