Bits + chips
Unimicron lands orders from TI and Apple, says paper
Commercial Times, September 9; Steve Shen, DIGITIMES

Unimicron Technology will soon begin to ship its FC CSP (flip-chip chip-scale-packaging) substrates to Texas Instruments (TI) for the production of ARM-based OMAP3 CPU lineups, according to a Chinese-language Commercial Times report.

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