Bits + chips
SPIL 4Q10 gross margin up on higher copper wire bonding sales
Olivia Hu, Taipei; Jessie Shen, DIGITIMES

Siliconware Precision Industries (SPIL) saw its gross margin increase to reach 14.3% in the fourth quarter of 2010, up 0.1pp sequentially and beating market estimates. The chip packager credited the result to growing sales of its copper wire bonding...

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