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Bits + chips
Driver IC packager Chipbond at almost full capacity on strong demand ahead of holiday season
Ingrid Lee, Taipei; Jessie Shen, DIGITIMES
Chipbond Technology has revealed it is currently running at near full capacity for COF (chip-on-film) and COG (chip-on-glass), and utilization for bumping has risen to 85-90%. Customers have begun to replenish their inventories in preparation for the...
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The coronavirus outbreak has disrupted production and weakened consumer confidence, with all ICT sectors bracing for major declines in shipments. Digitimes Research has conducted analyses on three mobile device sectors, namely notebooks, smartphones and tablets in the wake of the outbreak.