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Chip equipment billings up 32% sequentially in 1Q10, says SEMI

Press release
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SEMI has reported that worldwide semiconductor manufacturing equipment billings reached US$7.46 billion in the first quarter of 2010. The billings figure is 32% higher than that in the fourth quarter of 2009 and 142% above the same quarter a year ago.

The data was gathered in cooperation with the Semiconductor Equipment Association of Japan (SEAJ) from more than 120 global equipment companies that provide data on a monthly basis.

Worldwide semiconductor equipment bookings were US$9.41 billion in the first quarter, according to SEMI. The figure showed a 484% jump compared to the bookings figure during the same quarter of 2009, and 28% above the prior fourth quarter.

SEMI: Semiconductor manufacturing equipment billings by region, 1Q10 (US$b)

Region

1Q10

4Q09

1Q09

Q/Q

Y/Y

Taiwan

2.24

1.95

0.29

15%

674%

Korea

1.90

1.14

0.28

66%

572%

North America

0.90

0.86

1.12

5%

(19%)

Japan

0.87

0.58

0.79

49%

10%

ROW

0.81

0.57

0.13

42%

509%

China

0.42

0.30

0.10

39%

314%

Europe

0.31

0.26

0.36

20%

(14%)

Total

7.46

5.67

3.08

32%

142%

Source: SEMI, compiled by Digitimes, June 2010

Article translated by Jessie Shen