Bits + chips
Driver IC packaging firms see capacity utilization improve on China demand
Ingrid Lee, Taipei; Jessie Shen, DIGITIMES

Driver IC packaging and testing companies Chipbond Technology, International Semiconductor Technology (IST) and King Yuan Electronics Company (KYEC) have seen their recently capacity utilization rates climb to 40-50%, compared to 30-40% before the Lunar...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.