中文網
Taipei
Mon, Aug 15, 2022
09:01
clear
31°C
CONNECT WITH US

Applied Materials looks to drive TSV adoption

Michael McManus, DIGITIMES, Taipei 0

Applied Materials has announced that it is undertaking a major effort to enable the widespread adoption of through-silicon vias (TSVs), a rapidly-emerging approach for vertically stacking integrated circuits (ICs) to boost chip performance and functionality...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories