Bits + chips
SEMICON Taiwan 2008: Electronic materials from BASF to allow smaller IC feature sizes
Press release, September 9; Esther Lam, DIGITIMES

BASF is showcasing a range of advanced chemical solutions for the semiconductor industry at the ongoing SEMICON Taiwan 2008 (September 9-11), with solutions for 3D through-silicon via (TSV) being highlighted.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.