TSMC affiliate completes equipment installation at 12-inch WL-CSP fab
Ingrid Lee, Taipei; Rodney Chan, DIGITIMES
Image sensor packaging house Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC), has revealed that its has completed equipment installation at its first 12-inch wafer-level chip size packaging (WL-CSP) fab at the Hsinchu Science...
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