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TSMC, PSC, and VIS to construct fabs on last piece of land in Hsinchu Science Park

Hans Wu, Taipei
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Taiwan Semiconductor Manufacturing Company (TSMC), Powerchip Semiconductor Corporation (PSC), and Vanguard International Semiconductor (VIS) may soon be able to start constructing fabs on the last piece of available land at the Hsinchu Science Park, park authorities said yesterday.

The land has received a green light in an assessment in terms of environmental impact and urban planning, and construction may start as soon as land acquisition is completed, the authorities said.

TSMC and PSC each plan to construct two 12-inch fabs on the land, while VIS has yet to decide whether its new fab will be 8-inch or 12-inch, the authorities said.

TSMC said it has already told the park authorities that it wants to kick off construction in April of 2007, and that it hopes the land acquisition will proceed as scheduled.

PSC said it had yet to receive notification from the park authorities. But it maintained that as long as the park authorities allocate land, PSC would kick off its new fab project.

Article translated by Rodney Chan and edited by Eric Mah