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Qimonda and UTAC extend R&D development on ultra-thin die and MCP

Press release, September 25; Esther Lam, DIGITIMES Asia Monday 25 September 2006 0

Qimonda and the Singapore-based testing and packaging house United Test and Assembly Center (UTAC) announced on September 25 that they will extend their collaboration on ultra-thin large die-stacking process development by another 18 months.

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