Demand for flip-chip packaging to grow in 4Q 2004, pending substrate prices: sources say

Amy Lee, Taipei; Jack Lu, DIGITIMES Asia Thursday 25 December 2003 0

The migration from ball-grid array (BGA) to flip-chip (FC) packaging may accelerate in the fourth quarter of next year, if prices for FC turnkey services drop to about US$3.60 per chip from the US$4-5 range currently, according to sources.

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