Winbond to build 12-inch fab in Taichung, ProMOS and PSC may follow

Compiled from outside sources and Hans Wu, Taipei; Jack Lu, DIGITIMES Asia Friday 5 December 2003 0

Winbond Electronics plans to spend US$2.9 billion within the next five years to build a 12-inch fab in the Taichung Science-Based Industrial Park, according to Welson Wen, vice president of Winbond’s administrative center.

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